Hardware Specifications
Dynamic Domain aims to provide hardware that delivers maximum speed, reliability and capability for demanding workloads.
BUILD FOR SPEED
Our cutting-edge hardware ensures unparalleled speed, reliability, and capability for even the most demanding workloads. We carefully select enterprise-grade components to optimize performance during intensive operations. With redundant architecture, our systems offer exceptional uptime and resilience. The quick-access modular design facilitates effortless maintenance and upgrades. Through rigorous testing, we guarantee seamless integration with the latest software and peripherals. Whether you require a high-end workstation or storage array, our purpose-built hardware is designed to excel in your environment and accommodate future growth
HPE CRAY XD670 BOOST AI PERFORMANCE
HPE Cray XD670 System is a top-performing GPU-accelerated server, delivering a complete AI Training and Deep Learning. It offers a complete, scalable solution for AI & HPC customers everywhere, with flexibility of fabric, memory, storage and operating.
Built with high-speed networking technologies, integrated storage, a robust software portfolio and management tools, HPE Cray XD670 systems can enable customers to innovate and prepare for tomorrow’s challenges.
DETAILS
Nvidia GH200
| GPU Memory | 96 GB |
| GPU Memory Bandwidth | <=4 TB/s |
| Max Thermal Design Power (TDP) | 450W – 1000W (configurable) |
| Multi Instance GPUs | Up to 7 MIGS @ 10 GB each |
| Form Factor | SXM |
Nvidia HGX H200
| GPU Memory | 141 GB |
| GPU Memory Bandwidth | 4.8 TB/s |
| Max Thermal Design Power (TDP) | Up to 700W (configurable) |
| Multi Instance GPUs | Up to 7 MIGS @ 16.5 GB each |
| Form Factor | SXM |
Nvidia HGX H100
| GPU Memory | 80 GB |
| GPU Memory Bandwidth | 3.5 TB/s |
| Max Thermal Design Power (TDP) | Up to 7W (configurable) |
| Multi Instance GPUs | Up to 7 MIGS @ 10 GB each |
| Form Factor | SXM |
DETAILS
Nvidia GH200
| GPU Memory | 96 GB |
| GPU Memory Bandwidth | <=4 TB/s |
| Max Thermal Design Power (TDP) | 450W – 1000W (configurable) |
| Multi Instance GPUs | Up to 7 MIGS @ 10 GB each |
| Form Factor | SXM |
Nvidia HGX H100
| GPU Memory | 80 GB |
| GPU Memory Bandwidth | 3.5 TB/s |
| Max Thermal Design Power (TDP) | Up to 7W (configurable) |
| Multi Instance GPUs | Up to 7 MIGS @ 10 GB each |
| Form Factor | SXM |
Nvidia H100 PCIe
| GPU Memory | 96 GB |
| GPU Memory Bandwidth | 2 TB/s |
| Max Thermal Design Power (TDP) | 300 – 350W (configurable) |
| Multi Instance GPUs | Up to 7 MIGS @ 10 GB each |
| Form Factor | PCIe Dual-slot air-cooled |
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